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CFMS2024 | Longsys: Breaking through the curse of storage module management

CFMS2024 | Longsys: Breaking through the curse of storage module management

On 2024-03-26 in 15

On March 20, the 2024 China Flash Memory Market Summit (hereinafter referred to as "CFMS2024") was successfully held in Shenzhen. With the theme of "Storage Cycle Unlocks Potential", this year's CFMS2024 brought together the global storage industry chain and terminal application companies to discuss new trends. Opportunities under market conditions.At the CFMS2024 Summit, Longsys Chairman and General Manager Cai Huabo delivered a speech titled "Breaking through the Curse of Storage Module Management", sharing the company's strategy for comprehensive transformation and upgrading from a "storage module factory" to a "semiconductor storage brand enterprise" layout, and how to realize the model leap from sales model to core service.(Chairman and General Manager of Longsys Cai Huabo)Cai Huabo gave an in-depth analysis of the current operating pain points faced by storage module factories. With the intensification of market competition and inherent bottlenecks in business models, the current mainstream business models of traditional storage module factories are facing difficulties in breaking through the revenue ceiling of US$2 billion. To this end, Longsys has carried out innovative layout and transformation and upgrading in multiple dimensions such as technology, products, supply chain integration, brand and business model to break through the operating curse of storage module factories.R&D, packaging and testing integrationConsolidate the vertical integration strength of semiconductor storage technology-Self-developed SLC NAND Flash chip + main control chip-Cai Huabo said that Longsys insists on independent research and development and invests in core technologies. It has now mastered the design capabilities of SLC NAND Flash, MLC NAND Flash, and NOR Flash chips, especially in SLC NAND Flash chips, and has achieved large-scale mass production. The breakthrough of Flash's self-developed chip can not only better serve the storage needs of existing customers, but also help Longsys gain a more comprehensive and in-depth understanding of Flash underlying technology and chip manufacturing technology, further improving the company's overall storage products quality, as well as comprehensive competitiveness in the storage field.The main control chip plays a vital role in storage products, and its importance is self-evident. In the second half of 2023, the company's subsidiary Huiyi Microelectronics (WiseMem) launched WM6000 (eMMC 5.1 controller) and WM5000 (SD 6.1 memory card controller) self-developed main control chips. Both products use self-developed LDPC algorithms and Samsung's 28nm advanced process technology leads the industry in performance. This year, two self-developed main control chips have fully entered the stage of large-scale productization.From NAND Flash chips to cutting-edge firmware algorithms to main control chips, Longsys has achieved relatively complete independent design capabilities for memory chips, laying a solid foundation for the company's continued development and innovation in the storage industry. At the same time, Longsys will maintain an open and cooperative attitude, continue to strengthen in-depth cooperation and complementary cooperation with multiple main control solution manufacturers in the industry, fully meet the diverse needs of customers, and work together to create better storage products.-In-house packaging and testing manufacturing-With the acquisition of leading packaging, testing and manufacturing bases such as Yuancheng Suzhou and Zilia, as well as the self-built Zhongshan data center storage line, Longsys has built its own high-end packaging, testing and manufacturing center, all-round Lay out a domestic and overseas dual-cycle supply chain system to realize the integration of R&D, packaging and testing in various industrial chain links from chip design, software and hardware design, wafer processing, packaging and testing to production and manufacturing, further consolidating the company's vertical integration strength in semiconductor storage technology. At present, Zilia has successfully provided high-quality services to many leading brands around the world. At the same time, it actively provides overseas manufacturing solutions to Chinese customers, helping customers demonstrate excellent competitiveness in the global market. At present, Yuancheng Suzhou has successfully undertaken the packaging, testing and manufacturing tasks of some of the company's embedded storage and industrial-grade and automotive-grade storage, and all work is progressing well.Advanced technology of dual-brand high-energy storage products inspires the awakening of storage powerLongsys introduced in depth and demonstrated a series of innovative technologies and products in the field of storage applications of the company's two major brands Lexar and FORESEE at the summit, comprehensively demonstrating the company's achievements in consumer storage, embedded storage, and industrial planning. / Active exploration and breakthroughs in multiple application scenarios such as car-level storage and enterprise-level data storage.-Lexar innovative high-end memory card-1TB NM Card2TB microSD Card205MB/s reading speed 3.0 SD CardSince the successful release of the 512GB capacity NM Card at the end of last year, Lexar has once again made a product breakthrough, taking the lead in launching a 1TB ultra-large capacity NM Card version, which can be adapted to the card slots of many Hongmeng OS mobile phones/tablets to provide users with storage Space expansion. This product uses the WM6000 self-developed main control that is compatible with the eMMC protocol, and uses the advanced packaging process of Yuancheng Suzhou's ultra-thin NAND stacking technology to successfully achieve productization. With the promotion and popularization of China's storage standards and NM Card protocol by the ITMA Association, as well as the continuous iterative upgrade of terminal equipment, more models will support this ultra-large capacity NM Card in the future, providing users with more efficient mobile phone expansion solutions. .Lexar has also launched two industry-leading high-end memory cards for gaming and image storage applications. Among them, the 2TB large-capacity microSD Card relies on advanced 12Die stacking technology and ultra-thin grinding and cutting technology to overcome the bottleneck of packaging technology. On the basis of strictly following microSD size standards, it can achieve higher integration and release greater storage. space. Another SD 3.0 memory card has become the product focus with high-speed reading and writing of 205MB/s / 150MB/s, and its performance is leading the industry level. This memory card adopts the innovative 4Plane direct writing architecture to achieve dual-effect acceleration of SDIO and NAND-IO. Both products are equipped with WM5000 self-developed main control and self-developed firmware algorithms, bringing users a smoother and more efficient memory card experience.-FORESEE QLC eMMC-As the QLC NAND Flash market penetration rate rises rapidly, Longsys has grasped the market trend and taken the lead in applying advanced 3D QLC technology to eMMC products, launching FORESEE QLC eMMC to meet the "cost reduction and capacity expansion" needs of terminal applications. This product is also developed based on the WM6000 self-developed main control, using a unique QLC algorithm and self-developed firmware. After continuous technical optimization by the company's R&D team, it has passed a number of internal rigorous tests and has reached mass production status. In terms of performance and reliability, this product is already comparable to TLC eMMC; in terms of capacity, in addition to the 512GB specification launched this time, Longsys also has the technical capabilities to achieve a larger capacity of 1TB and will provide the market with More diverse choices.In order to meet the growing demand for 5G mobile phone storage capacity, the company's embedded storage product FORESEE UFS2.2 has officially started large-scale mass production and shipment, providing high-performance, large-capacity storage solutions for the smart terminal market. At present, Longsys has built a comprehensive layout in the field of embedded storage that combines composite storage and separated storage, and has met many strict vehicle regulatory system standards such as AEC-Q100, IATF16949, PPAP, etc., empowering industry innovation .-FORESEE LPCAMM2 new memory form-At this CFMS summit, Longsys also released FORESEE LPCAMM2 (16GB/32GB/64GB). With its unique 128bit width design, this product has achieved a new breakthrough in memory form and is expected to open up PC and mobile phone storage application scenarios. Compared with the traditional SODIMM form, LPCAMM2 has reduced its size by nearly 60%, increased energy efficiency by nearly 70%, and reduced power consumption by nearly 50%. At the same time, its speed is as high as 9600Mbps, far exceeding the 6400Mbps of DDR5 SODIMM, breaking the traditional memory speed. bottleneck. Compared with on board LPDDR products, LPCAMM2's flexible modular appearance not only has excellent scalability, but also provides higher maintainability for terminal equipment, helping customers reduce after-sales difficulties and achieve more convenient upgrades. The innovative form of LPCAMM2 brings a dramatic improvement in performance and energy efficiency to application scenarios that have strict requirements on small size, such as AI terminals, commercial equipment, and ultra-thin notebooks, and is expected to lead the mainstream direction of memory development. In the future, the capacity of FORESEE LPCAMM2 memory products will gradually increase with technological development and customer demand. -FORESEE CXL 2.0 memory expansion module-In recent years, Longsys has embarked on a heavy investment model and continued to increase its efforts in the field of enterprise-level storage R&D, creating an eSSD+RDIMM product application portfolio and a dedicated data center storage manufacturing line. It has now broken through industry benchmark customers in multiple fields and achieved large-scale Volume production and delivery.With the rapid development of AI, computing-intensive workloads have placed unprecedentedly high demands on low-latency and high-bandwidth storage. Compute Express Link® (CXL®) interconnect technology opens new ways to improve data center performance and efficiency. Driven by cutting-edge technology trends, Longsys took the lead in releasing and demonstrating on-site its first FORESEE CXL 2.0 memory expansion module designed with self-developed architecture at this CFMS2024, which supports memory pool sharing and brings new possibilities to enterprise-level application scenarios. breakthrough. Through unique stacking technology, this product can achieve a large capacity of 128GB based on 16Gb SDP particles, achieving a significant cost reduction compared to the same period in the industry.FORESEE CXL 2.0 memory expansion module is developed based on DDR5 DRAM, supports PCIe 5.0×8 interface, and has a theoretical bandwidth of up to 32GB/s. It can achieve seamless connection with backplanes and server motherboards that support CXL specifications and E3.S interfaces, and reduce expensive Memory costs and idle memory resources can be greatly improved, thereby effectively expanding the server's memory capacity and improving bandwidth performance, helping to unleash the potential of HPC, cloud computing, AI and other application scenarios.In terms of capacity, the FORESEE CXL 2.0 memory expansion module can achieve a variety of capacity options, including 64GB, 128GB, 192GB and 512GB under development, which fully meets the storage needs of users in different computing applications. It is worth mentioning that compared with the mainstream 32GB and 64GB similar products on the market, the FORESEE CXL 2.0 memory expansion module shows significant advantages in capacity. Currently, FORESEE CXL 2.0 memory expansion module and LPCAMM2 products are ready for full-scale mass production and will be put into production in an orderly manner to meet market demand.TCM innovative business modelImprove the comprehensive competitiveness of the storage industryCai Huabo emphasized that Longsys is undergoing a major upgrade of its business model. In order to provide Tier 1 customers with more stable supply and efficient customized storage solution services, Longsys collaborates with upstream storage wafer fabs to jointly propose a transformation from the traditional product sales model to a TCM (Technologies Contract Manufacturer, Technology Contract Manufacturing) cooperation model. upgrade. Under the traditional sales model, storage module manufacturers first purchase wafers from the original storage factory, and then sell them to end customers after going through R&D, design, packaging, testing and manufacturing. The complexity of the intermediate links between the upstream original manufacturers and downstream end customers has led to "disconnections" in communication, and it is also difficult to efficiently match the downstream application market's demand for diversified, customized, and innovative storage products. Module factories also need to purchase large amounts of wafers from original factories in advance for reserve, and face challenges such as huge price fluctuations brought about by the industry cycle. The TCM (Technical Contract Manufacturing) cooperation model enables efficient and direct supply and demand information communication between upstream storage wafer original manufacturers and downstream Tier1 core customers. Based on deterministic supply and demand contracts, Longsys focuses on the advantages of the storage solution service platform and integrates storage master control , firmware custom development, high-end packaging and testing technology, after-sales service, brand and intellectual property and other capabilities, based on the product needs of upstream storage wafer fabs or downstream Tier1 customers, we can efficiently complete one-stop delivery of storage products. This will improve the efficiency and effectiveness of the storage industry chain from original factories, product development, packaging and testing, product manufacturing to industry applications. The TCM model aims to create a new anchoring relationship between supply and demand, upgrading the collaborative operation of the industrial chain from the traditional "one-way simplex mode" to a "two-way duplex mode". Under this mode, the original factory can communicate with downstream Tier 1 in a more timely manner Customers conduct information docking, observe real market demand, plan production capacity and resource pricing according to market demand, and focus more on wafer process innovation and production capacity improvement in terms of technology investment, while Longsys will focus on subsequent storage product research and development, customer customization, Integrate packaging, testing, manufacturing and delivery. At the same time, downstream Tier 1 customers can obtain a stable supply of storage resources and the opportunity to deeply participate in the pricing mechanism based on the aforementioned docking and exchange mechanism with the original manufacturer. Longsys will focus on providing customers with more flexible, open, transparent and innovative customization Store products and services to optimally meet the business demands of original manufacturers and Tier1 customers.As a leading domestic semiconductor storage brand enterprise, Longsys can provide comprehensive industry services throughout the entire chain from memory chip research and development to packaging, testing and manufacturing, and has industrial advantages and accumulation in multiple dimensions such as technology, manufacturing, services, intellectual property, quality, and capital. , has enough strength to integrate the complex intermediate links from upstream original manufacturers to downstream applications, while assisting and serving original manufacturers to improve their operating efficiency, flexibility and customer satisfaction, while jointly providing more stable storage for downstream application Tier1 end customers Resource supply guarantee, more flexible product customization and technical support, and more complete comprehensive services, thereby opening up multiple links in the value chain, jointly building storage resource transparency, technology manufacturing value, comprehensive service customization, and maximizing delivery efficiency. transaction costs minimizedA new cooperation ecosystem to enhance the comprehensive competitiveness of the storage industry.Customized business operates independentlyService precise focusCai Huabo pointed out that Longsys’ original traditional customization and sales business will be fully undertaken and independently operated by Mestor, a wholly-owned subsidiary, to further optimize the company’s overall business layout and achieve multi-point collaboration and efficient development. . Maxdu Electronics focuses on the R&D, manufacturing and sales of general-purpose memories. It has diversified product lines and independent manufacturing capabilities, and provides professional and efficient OEM/ODM/DMS storage services to domestic and foreign customers.

Microsoft releases first AI PC

Microsoft releases first AI PC

On 2024-03-26 in 3

Microsoft has announced the first Surface AI-powered computers built specifically for business users: Surface Pro 10 Business Edition and Surface Laptop 6 Business Edition. Both will begin shipping to commercial customers on April 9, with prices starting at $1,199 (approximately RMB 8,632). But it will not be sold directly to consumers.With the arrival of the first AI PCs, Microsoft is expected to add many artificial intelligence features to Windows systems later this year, and these two new devices will be ready for them.Microsoft's first AI PC debutsFrom the appearance, these two products have no updates compared to their predecessors. The only change is the addition of dedicated CoPilot keys for Microsoft’s artificial intelligence assistant on the keyboard.In January this year, Microsoft specially introduced the Copilot key: it is the first major keyboard change for Windows PCs in nearly thirty years, and can start the Copilot experience of Windows PCs with one click.In terms of configuration, the new PC launched this time uses the latest Intel Core Ultra processor, which is the most significant upgrade of these two products: Surface Pro 10 uses Core Ultra 5 135U or Core Ultra 7 165U chip, while the previous The Surface Pro 9 business version is powered by a Core i5-1245U or i7-1265U chip, so this CPU upgrade means Microsoft skipped the 13th-generation chip and went directly from the outdated 12th-generation chip to the one just a few months ago. The launch of the Core Ultra chip.In addition, these two computers also have the neural network processing unit (NPU), the core "brain" of the intelligent computing era that accelerates the execution of AI tasks. By integrating the NPU, it can provide users with AI capabilities including Windows Studio Effects and real-time subtitles, and enable enterprises and developers to build their own AI applications and experiences.With AI-assisted Windows Studio effects, users can enable automatic framing to keep their face in the center of the frame and the background always blurred. Acer and HP have previously launched laptops using Core Ultra chips, which also have this effect.Microsoft has also improved the Surface Pro 10’s 13-inch display with a new anti-reflective coating that’s 33 percent brighter.The front camera of Surface Pro 10 has been upgraded from 1080p of Pro 9 to 1440p, and the camera will have a 114-degree wide-angle field of view, allowing it to cooperate with AI-enhanced camera functions; the front camera of Surface Laptop 6 has been upgraded from the previous 720p to 1080p.In terms of performance, Surface Laptop 6 is twice as fast as Surface Laptop 5, and Surface Pro 10 is 53% faster than the previous generation Surface Pro 9.Microsoft is also including an NFC reader on Surface Pro 10 Business, making it easy for businesses to authenticate using devices like the YubiKey NFC security key. Microsoft also plans to offer a 5G option for the Surface Pro 10 Business Edition.In addition, Microsoft plans to host a special Windows and Surface artificial intelligence event on May 20, where Microsoft CEO Satya Nadella will share the company's "artificial intelligence vision" in software and hardware. , consumer versions of Surface Pro 10 and Surface Laptop 6 are expected to debut.The industrial chain is expected to usher in a new round of rising volume and priceOn March 21, the AMD AI PC Innovation Summit was held in Beijing. The theme of this summit is "Advancing AI PC". Many technology giants in the industry participated and revealed their layout on AI PC. The AI capabilities of AMD Ryzen 8040 series mobile processors and the Ryzen AI Software platform were demonstrated at the conference.AMD CEO Su Zifeng said that millions of Ryzen AI PCs have been shipped. AMD has not only empowered the digital lives of billions of people, but will also adhere to its commitment to Greater China in the future, such as setting up major R&D centers. , AI Center of Excellence, empowering large enterprises, joint R&D and ecological co-construction, etc.Liu Jun, executive vice president of Lenovo Group and president of China, said that Lenovo Group will hold the Lenovo Innovation and Technology Conference on April 18, where the latest strategy and new products of Lenovo AI PC will be released.Canalys predicts a wave of AI-powered models will emerge in the first half of 2024.The AI PC market is expected to grow rapidly in 2025 and 2026, given the launch of the latest Windows operating system in late 2024 that will release AI-enhanced features and the widespread application of AI tools in business and productivity software. Canalys predicts that by 2027, global AI PC shipments are expected to exceed 170 million units, accounting for more than 60% of total personal computer shipments. The CAGR of AI PC shipments from 2023 to 2027 will reach 63%.Industrial Securities said that major technology giants such as Microsoft are applying large AI models to terminal devices such as PCs, and the penetration of edge-side AI is expected to accelerate, which will in turn drive an explosion in demand for computing power and increase the value of servers, AI chips, optical chips, storage, PCB boards and other links. will be significantly improved.According to statistics, there are 61 listed companies in the A-share market that have deployed the AI PC industry chain, and 6 of them rose in early trading. Tongyou Technology, Northern Huachuang, and Sangfor were the top gainers, rising 8.13%, 4.21%, and 3.27% respectively.From the perspective of capital flow, 24 AI PC concept stocks have received net inflows from northbound funds since March, of which 14 stocks have net inflows exceeding 100 million yuan, with Vail Holdings and North Hua Chuang leading the net inflows, both exceeding 1 billion yuan.

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On 2024-03-06 in ASIC 2

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